Latest HBM chips from Electronics fail Nvidia’s tests due to heat and power issues. Sources attribute the problem to unresolved challenges.
The issues impact Samsung’s HBM3 chips, the fourth-generation HBM standard prevalent in GPUs for AI. Additionally, fifth-generation HBM3E chips, introduced by Samsung and competitors, face similar challenges.
The reasons for Samsung failing Nvidia’s tests are being reported for the first time.
Samsung said in a statement to Reuters that HBM is a customised memory product requiring “optimisation processes in tandem with customers’ needs,” adding that it is in the process of optimising its products through close collaboration with customers. It declined to comment on specific customers.
Nvidia declined to comment.
HBM – a type of dynamic random access memory or DRAM standard first produced in 2013 in which chips are vertically stacked to save space and reduce power consumption – helps process massive amounts of data produced by complex AI applications. As demand for sophisticated GPUs has soared amid the generative AI boom, so has demand for HBM.
Transitioning to the future outlook, resolving the issues with Samsung HBM chips is crucial for the advancement of graphics and computing technologies. By overcoming these challenges, both companies can ensure the delivery of high-performance products to meet the demands of modern applications.
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